Sundeep Bajikar is a global technology investor, author, and technologist. He is Managing Director of acteve LLC, an independent investment advisory firm based in San Francisco. Sundeep also provides consulting services to a variety of technology industry organizations. Previously, Sundeep was Senior Vice President and Senior Analyst covering global technology stocks at Jefferies LLC, and became the first analyst to cover both Apple and Samsung Electronics concurrently. His coverage ranged from Semiconductors and SemiCap Equipment to IT Hardware, with total company market capitalization of nearly a trillion dollars. Prior to Jefferies, Sundeep was a Senior Analyst at Morgan Stanley for 5 years, covering Semiconductors. Combined, Sundeep has more than 9 years of experience in equity research, and has published hundreds of research reports as a sellside analyst. Sundeep has also consulted for Vine Street Capital Management LLC, an independent investment management firm based in the San Francisco Bay Area.
Prior to becoming an equity research analyst Sundeep spent 9 years of his career at Intel Corporation in various engineering and strategic planning roles. He holds more than 10 U.S. and international patents pertaining primarily to mobile device location and security technologies, with more than 20 additional patents pending.
During his career as a Wall Street analyst covering Global Technology Stocks, Sundeep was frequently quoted in the Wall Street Journal, Barron's, MarketWatch, The New York Times, CNN, CNBC, Bloomberg, and other media, particularly for his out-of-consensus coverage of Apple, Samsung Electronics, and Micron. He was voted Rising Star in Semiconductor Equity Research, in the Institutional Investor 2014 survey, and received Honorary Mention in the 2013 survey.
Sundeep holds an MBA in Finance from The Wharton School in addition to M.S. degrees in Electrical Engineering and Mechanical Engineering from University of Minnesota, and additional graduate engineering NDO coursework at Stanford University. Sundeep earned his B.S. in Mechanical Engineering from College of Engineering, Pune.
Select Media Mentions
Barron's: Samsung: Ready to Rebound
Barron's: Samsung Will Beat Back Xiaomi in 2015
New York Times: Chip Profits Help Soften Other Losses at Samsung
Intelligent Transportation Systems: Evaluation of In-Vehicle GPS-Based Lane Position Sensing for Preventing Road Departure
MnDOT Research: Magnetic Lateral Indication System Evaluation
MnDOT Research: Evaluation of RADAR for Snowplows
Institute of Navigation: Time-Based GPS Trajectory Guidance
US7191281B2: Mobile computer system having a navigation mode to optimize system performance and power management for mobile applications.
US7191281B2: Method and system and authenticating a user of a computer system that has a trusted platform module (TPM).
US20030003943A1: Mobile computer system having a navigation mode to optimize system performance and power management for mobile applications.
US6577274B1: Method and apparatus for controlling access to mobile devices.
US20020194500A1: Bluetooth based security system.
US7117008B2: Mitigating interference among multiple radio device types.
US20030125019A1: Mitigating interference among multiple radio device types.
US20040198374A1: Location control and configuration system.
US20050039013A1: Method and system for authenticating a user of a computer system that has a trusted platform module (TPM).
US20030184474A1: Method and apparatus for controlling access to mobile devices.
US20030112178A1: Method and apparatus for location based wireless roaming between communication networks.
US20040203872A (pending): Wireless network location estimation.
US20070042754A1 (pending): Security parameter provisioning in an open platform using 3G security infrastructure.
US20050133582A1 (pending): Method and apparatus for providing a trusted time stamp in an open platform.
US20060075259A1 (pending): Method and system to generate a session key for a trusted channel within a computer system.
US20050108534A1 (pending): Providing services to an open platform implementing subscriber identity module (SIM) capabilities.
US20050108171A1 (pending): Method and apparatus for implementing subscriber identity module (SIM) capabilities in an open platform.